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BIODEVICES is part of BIOSTEC, the 11th International Joint Conference on Biomedical Engineering Systems and Technologies.
Registration to BIODEVICES allows free access to all other BIOSTEC conferences.
 
The purpose of the International Conference on Bio-Devices is to bring together researchers and practitioners from electronics, mechanical engineering, physics and related areas who are interested in developing, studying and using innovative materials, devices and systems inspired by biological systems and/or addressing biomedical requirements. Monitoring and diagnostics devices, sensors and instrumentation systems, biorobotics and prosthetics, micro-nanotechnologies including microfluidics systems and biomaterials are some of the technologies addressed at this conference. The fabrication and evaluation of biodevices, including wearable and implantable devices is also addressed.
 

Conference Co-chairs

Hugo GamboaLIBPHYS-UNL / FCT - New University of Lisbon, Portugal
Ana FredInstituto de Telecomunicações and Instituto Superior Técnico (University of Lisbon), Portugal
Sergi Bermudez i BadiaUniversidade da Madeira, Funchal, Portugal, Portugal

PROGRAM CHAIR

Alberto Cliquet JrElectr.Engr. & Orthopedics, University of São Paulo & University of Campinas, Brazil

Keynote Speakers

Anatole LécuyerInria Rennes/IRISA, Hybrid Research Team, France
Corina SasSchool of Computing and Communications, Lancaster University, United Kingdom
Dinesh KumarElectrical And Computer Engineering, RMIT University, Australia
Maximiliano RomeroUniversità Iuav di Venezia, Italy

Workshops



Doctoral Consortium

Chairs: Jan Schier and Alberto Cliquet Jr
 

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library


It is planned to publish a short list of revised and
extended versions of presented papers with Springer
in a CCIS Series book (final approval pending)

In Cooperation with:

ACM In-Cooperation
ACM SIGBio  ACM SIGAI 

EUROMICRO   EAMBES   ISCB   BMES   AAAI   ISfTeH  
SSBE   LFTY                  


Proceedings will be submitted for indexation by:

DBLP   Thomson   INSPEC   EI   SCOPUS  

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