Dharma Agrawal,
SCSI, University of Cincinnati, United States
Nizametin Aydin,
Computer Engineering, Yildiz Technical University, Turkey
Dinesh Bhatia,
Associate Professor,
Biomedical Engineering Department
North Eastern Hill University (NEHU), North Eastern Hill University, India
Wenxi Chen,
Biomedical Information Engineering Lab, The University of Aizu, Japan
Tom Chen,
Electrical & Computer Engineering, Colorado State University, United States
James M. Conrad,
Electrical and Computer Engineering, University of North Carolina at Charlotte, United States
Carlos Correia,
Physics, University of Coimbra, Portugal
Vladimir Devyatkov,
Department of Information systems and telecommunications, Bauman Moscow State Technical University, Russian Federation
Fernando Di Sciascio,
Independent Researcher, Argentina
Maeve Duffy,
Independent Researcher, Ireland
George S. Dulikravich,
Mechanical and Materials Eng., MAIDROC, Florida International University, United States
Elisabetta Farella,
ICT Center, Fondazione Bruno Kessler, Italy
Mireya Fernández Chimeno,
Departament d'Enginyeria Electrònica, Universitat Politècnica de Catalunya, Spain
Paddy French,
Electronic Instrumentation Laboratory, Delft University of Technology, Netherlands
Anselmo Frizera,
Electrical Engineering Department, UFES, Brazil
Hugo Gamboa,
LIBPHYS-UNL / FCT - New University of Lisbon, Portugal
Juan Carlos Garcia,
Electronics, University of Alcala, Spain
Miguel A. García Gonzalez,
Electronic Engineering Department, Universitat Politècnica de Catalunya, Spain
Javier Garcia-Casado,
Centro de Investigación e Innovación en Bioingeniería, Universitat Politècnica de València, Spain
Xiyi Hang,
Electrical & Computer Engineering, California State University, United States
Hans L. Hartnagel,
Fachgebiet Mikrowellenelektronik, Technische Universität Darmstadt, Germany
Toshiyuki Horiuchi,
Advanced Machinery Engineering, Tokyo Denki University, Japan
Leonid Hrebien,
Electrical and Computer Engineering, Drexel University, United States
Jiri Jan,
Biomedical Engineering, Faculty Of El.eng. And Communication, University of Technology Brno, Czech Republic
Sandeep K. Jha,
Centre for Biomedical Engineeirng, Indian Institute of Technology Delhi, India
Bozena Kaminska,
Engineering Science, Simon Fraser University, Canada
Michael Kraft,
Electrical Engineering and Computer Science, University of Liege, Belgium
Ondrej Krejcar,
Center for Basic and Applied Research // Faculty of informatics and management, University of Hradec Kralove, Czech Republic
Hongen Liao,
Department of Biomedical Engineering, Tsinghua University, China
Chwee T. Lim,
Department of Bioengineering, National University of Singapore, Singapore
Chin-Teng Lin,
National Chiao Tung University, Taiwan, Republic of China
Anita Lloyd Spetz,
Dept Physics, Chemistry and Biology, Linköpings Universitet, Sweden
Mai S. Mabrouk,
Biomedical Informatics, School of Information Technology and computer Science (ITCS), Nile University, Egypt
Jarmo Malinen,
Department of Mathematics and Systems Analysis, Aalto University, Finland
Dan Mandru,
Mechanisms, Fine Mechanics and Mechatronics, Technical University of Cluj Napoca, Romania
Joaquim Mendes,
Departamento de Engenharia Mecânica, Faculty of Engineering, University of Porto, Portugal
Cheryl D. Metcalf,
Faculty of Health Sciences, University of Southampton, United Kingdom
Vojkan Mihajlovic,
Body Area Networks, Holst Centre / imec the Netherlands, Netherlands
Saibal Mitra,
Physics, Astronomy and Materials Science, Missouri State University, United States
Joseph Mizrahi,
Faculty of Biomedical Engineering, Technion, Israel Institute of Technology, Israel
Jorge E. Monzon,
of Engineering, Universidad Nacional del Nordeste, Argentina
Raimes Moraes,
Departamento de Engenharia Eletrica e Eletrônica, Universidade Federal de Santa Catarina, Brazil
Raul Morais,
Departamento de Engenharias, UTAD - Escola de Ciencias e Tecnologia, Portugal
Umberto Morbiducci,
Mechanics, Politecnico di Torino, Italy
Alexandru Morega,
Electrical Engineering, University Politehnica of Bucharest, Romania
Michael R. Neuman,
Biomedical Engineering, Michigan Technological University, United States
Robert W. Newcomb,
Electrical and Computer Engineering, University of Maryland, United States
Mónica Oliveira,
Departament of Mechanical and Aerospace Engineering, University of Strathclyde, United Kingdom
Abraham Otero,
Escuela Politécnica Superior, Universidad San Pablo CEU, Spain
Gonzalo Pajares,
Software Engineering and Artificial Intelligence, Universidad Complutense de Madrid, Spain
Danilo Pani,
Dept. of Electrical and Electronic Engineering, University of Cagliari, Italy
Sofia Panteliou,
Mechanical Engineering & Aeronautics, University of Patras, Greece
Kwang S. Park,
Department of Biomedical Engineering,, College of Medicine, Seoul National University, Korea, Republic of
Jürgen Popp,
Friedrich-Schiller-Universität Jena, Germany
Mark A. Reed,
Yale University, United States
Dmitry Rogatkin,
Laboratory of medical and physics research, Moscow Regional Research and Clinical Institute "MONIKI", Russian Federation
Seonghan Ryu,
Information and Communication Engineering, Hannam University, Korea, Republic of
Chutham Sawigun,
Department of Electronic Engineering, Mahanakorn University of Technology, 140 Cheumsamphan rd., Nongchok, Mahanakorn University of Technology, Thailand
Michael J. Schöning,
Institute of Nano- and Biotechnologies, FH Aachen, Germany
Rahamim Seliktar,
School of Biomedical Engineering, Drexel University, United States
Mauro Serpelloni,
via Branze 38, University of Brescia, Italy
Alcimar B. Soares,
Faculdade de Engenharia Elétrica, Universidade Federal de Uberlândia, Brazil
Sameer Sonkusale,
Electrical and Computer Engineering, Tufts University, United States
Paul Sotiriadis,
ECE, National Technical University of Athens, Greece
João P. Teixeira,
Department of Electronics, CEDRI, Instituto Politécnico de Bragança, Portugal
Egon L. van den Broek,
Utrecht University, Netherlands
Bruno Wacogne,
MN2S, FEMTO-ST, UMR CNRS 6174, France
Tim Wark,
Commonwealth Scientific and Industrial Research Organisation, Australia
Huikai Xie,
Electrical and Computer Engineering, University of Florida, United States
Sen Xu,
Process Development and Engineering, Merck & Co., Inc., United States
Wuqiang Yang,
Independent Researcher, United Kingdom
Hakan Yavuz,
Cukurova University, Engineering Faculty, Department of Mechanical Engineering, Çukurova Üniversity, Turkey
Stefan Zappe,
Biomedical Engineering, Carnegie Mellon University, United States
Aladin Zayegh,
College of Engineering and Science, Victoria University, Australia
Yuan-Ting Zhang,
Joint Research Center, EE Department, Chinese university of Hong Kong, Hong Kong