BIODEVICES is part of BIOSTEC, the 17th International Joint Conference on Biomedical Engineering Systems and Technologies. Registration to BIODEVICES allows free access to all other BIOSTEC conferences.
BIOSTEC 2024 will be held in conjunction with MODELSWARD 2024.
Registration to BIOSTEC allows free access to the MODELSWARD conference (as a non-speaker).
Although the conference is back to the normal mode (i.e., in-person) speakers are allowed to present remotely if unable to travel to the venue (hybrid support).
The purpose of the International Conference on Biomedical Electronics and Devices is to bring together researchers and practitioners from electronics, mechanical engineering, physics and related areas who are interested in developing, studying and using innovative materials, devices and systems inspired by biological systems and/or addressing biomedical requirements. Monitoring and diagnostics devices, sensors and instrumentation systems, biorobotics and prosthetics, micro-nanotechnologies including microfluidics systems and biomaterials are some of the technologies addressed at this conference. The fabrication and evaluation of biodevices, including wearable and implantable devices is also addressed.
Ana Fred, Instituto de Telecomunicações and Instituto Superior Técnico (University of Lisbon), PortugalHugo Gamboa, LIBPhys, Physics Department, Nova School of Science and Technology, Nova University of Lisbon, Portugal
Maria Pedro Guarino, Health Sciences, Polytechnic University of Leiria, Portugal
Norbert Noury, University of Lyon, FranceAnna Maria M. Bianchi, Depertment of Bioingeneering, Politecnico di Milano, ItalyRobert Turner, Neurophysics, Max Planck Institute for Human Cognitive and Brain Sciences, United KingdomJuan Carlos Augusto, Department of Computer Science, Faculty of Science and Technology, Middlesex University, United Kingdom
Publications:
It is planned to publish a short list of revised and
extended versions of presented papers with
Springer in a CCIS Series book (final approval pending)
Technically co-sponsored by:
In Cooperation with:
Proceedings will be submitted for evaluation for indexing by: