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BIODEVICES is part of BIOSTEC, the 14th International Joint Conference on Biomedical Engineering Systems and Technologies.
Registration to BIODEVICES allows free access to all other BIOSTEC conferences.
 
The purpose of the International Conference on Biomedical Electronics and Devices is to bring together researchers and practitioners from electronics, mechanical engineering, physics and related areas who are interested in developing, studying and using innovative materials, devices and systems inspired by biological systems and/or addressing biomedical requirements. Monitoring and diagnostics devices, sensors and instrumentation systems, biorobotics and prosthetics, micro-nanotechnologies including microfluidics systems and biomaterials are some of the technologies addressed at this conference. The fabrication and evaluation of biodevices, including wearable and implantable devices is also addressed.
 


Conference Co-chairs

Ana FredInstituto de Telecomunicações and University of Lisbon, Portugal
Hugo GamboaLIBPhys, Physics Department, Nova School of Science and Technology, Nova University of Lisbon, Portugal

PROGRAM CO-CHAIRS

Claudine GehinINSA-Lyon, France
Bruno WacogneFEMTO-ST, UMR CNRS 6174, France

Keynote Speakers

Athanasios TsanasUniversity of Edinburgh, United Kingdom
Thomas OstermannUniversität Witten/Herdecke, Germany
Mireya Fernández ChimenoUniversitat Politècnica de Catalunya, Spain
Tiago GuerreiroFaculdade de Ciências, Universidade de Lisboa, Portugal


 
Publications:
Science and Technology Publications, Lda

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library
(consult SCITEPRESS Ethics of Publication)

Springer Nature Computer Science

A short list of best papers will be invited
for a post-conference special issue of the
Springer Nature Computer Science Journal

Communications in Computer and Information Science

It is planned to publish a short list of revised and
extended versions of presented papers with
Springer in a CCIS Series book

Technically co-sponsored by:

Technically co-sponsored by:

In Cooperation with:

Proceedings will be submitted for indexation by:


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