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BIODEVICES is part of BIOSTEC, the 12th International Joint Conference on Biomedical Engineering Systems and Technologies.
Registration to BIODEVICES allows free access to all other BIOSTEC conferences.


BIOSTEC 2019 will be held in conjunction with MODELSWARD 2019 and ICISSP 2019.

Registration to BIOSTEC allows free access to the MODELSWARD and ICISSP conferences (as a non-speaker).

 
The purpose of the International Conference on Biomedical Electronics and Devices is to bring together researchers and practitioners from electronics, mechanical engineering, physics and related areas who are interested in developing, studying and using innovative materials, devices and systems inspired by biological systems and/or addressing biomedical requirements. Monitoring and diagnostics devices, sensors and instrumentation systems, biorobotics and prosthetics, micro-nanotechnologies including microfluidics systems and biomaterials are some of the technologies addressed at this conference. The fabrication and evaluation of biodevices, including wearable and implantable devices is also addressed.
 

Conference Co-chairs

Ana FredInstituto de Telecomunicações and Instituto Superior Técnico (University of Lisbon), Portugal
Hugo GamboaLIBPHYS-UNL / FCT - New University of Lisbon, Portugal

PROGRAM CHAIR

Ana Cecilia RoqueUCIBIO, Departamento de Química, Faculdade de Ciências e Tecnologia da Universidade Nova de Lisboa, Portugal

Keynote Speakers

Hossam HaickIsrael Institute of Technology, Israel
Andres Diaz LantadaMechanical Engineering, Universidad Politecnica de Madrid, Spain
Henrique MartinsFaculdade de Ciencias da Saude, Universidade da Beira Interior, Portugal


Doctoral Consortium

Chairs: Bruno Wacogne and Cláudia Quaresma
 
Publications:
Science and Technology Publications, Lda

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library
(consult SCITEPRESS Ethics of Publication)

Communications in Computer and Information Science

It is planned to publish a short list of revised and
extended versions of presented papers with
Springer in a CCIS Series book

In Cooperation with:

Proceedings will be submitted for evaluation for indexing by:


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