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BIODEVICES is part of BIOSTEC, the 13th International Joint Conference on Biomedical Engineering Systems and Technologies.
Registration to BIODEVICES allows free access to all other BIOSTEC conferences.


BIOSTEC 2020 will be held in conjunction with ICAART 2020, MODELSWARD 2020 and ICPRAM 2020.

Registration to BIOSTEC allows free access to the ICAART, MODELSWARD and ICPRAM conferences (as a non-speaker).

 
The purpose of the International Conference on Biomedical Electronics and Devices is to bring together researchers and practitioners from electronics, mechanical engineering, physics and related areas who are interested in developing, studying and using innovative materials, devices and systems inspired by biological systems and/or addressing biomedical requirements. Monitoring and diagnostics devices, sensors and instrumentation systems, biorobotics and prosthetics, micro-nanotechnologies including microfluidics systems and biomaterials are some of the technologies addressed at this conference. The fabrication and evaluation of biodevices, including wearable and implantable devices is also addressed.
 


Conference Co-chairs

Ana FredInstituto de Telecomunicações and Instituto Superior Técnico (University of Lisbon), Portugal
Hugo GamboaNova University of Lisbon, Portugal

PROGRAM CHAIR

Ye XuesongZhejiang University, China

Keynote Speakers

Roy RuddleUniversity of Leeds, United Kingdom
Helena CanhãoUniversidade NOVA de Lisboa, Portugal
Petia RadevaUniversitat de Barcelona, Spain
Silvana QuagliniDept. of Electrical, Computer and Biomedical Engineering, University of Pavia, Italy



Doctoral Consortium

Chair: Andres Diaz Lantada
 
Publications:
Science and Technology Publications, Lda

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library
(consult SCITEPRESS Ethics of Publication)

Communications in Computer and Information Science

It is planned to publish a short list of revised and
extended versions of presented papers with
Springer in a CCIS Series book

Technically co-sponsored by:

Technically co-sponsored by:

In Cooperation with:

Proceedings will be submitted for evaluation for indexing by:


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